Tuesday 27 February 2018

Qualcomm Introduces Snapdragon 700 Mobile Platform Series at MWC 2018

Qualcommannounced its Snapdragon 700 series of processors designed for mobile devices. At present, Qualcomm has yet to provide any details on when device owners can expect to see a 700-series processor powering their device
Qualcomm Introduces Snapdragon 700 Mobile Platform Series at MWC 2018


Company has confirmed the plan is to begin sampling the new series out to its customers (OEMs) in the first half of this year. At which point the onus on delivery to market will switch to the manufacturers.

The Snapdragon 700 Mobile Platform Series is engineered to offer advancements in:

AI: Snapdragon 700 Series products will come with the multi-core Qualcomm AI Engine delivering up to 2x improvements for on-device AI applications compared to the Snapdragon 660 Mobile Platform. Through heterogeneous computing, the new architectures of the 700 Series – the Hexagon Vector Processor, Adreno Visual Processing subsystem, and Kryo CPU – work cooperatively to effortlessly capture and share videos, learn voice and speech and make your device last on a single charge without changing applications or settings.

Camera: The Snapdragon 700 Series will unleash the limitless power of the Qualcomm Spectra ISP and make you love capturing your life experiences during all parts of the day and night, in slow-motion, or with the help of AI. Expect a multitude of additional professional grade camera features, supported by high-quality specs, to reside in the 700 Series.

Performance and Battery: The Snapdragon 700 Series will debut new architectures across the mobile platform, including Qualcomm Spectra ISP, Kryo CPU and Adreno Visual Processing subsystem, which will offer up to 30% improvements in power efficiency, and better performance and battery life across numerous applications compared to the Snapdragon 660 Mobile Platform. 700 Series products will also benefit from Qualcomm® Quick Charge™ 4+ technology, engineered to get up to 50% charge in only 15 minutes*.

Connectivity: The Snapdragon 700 Tier will feature an advanced suite of wireless technologies with ultra-fast LTE, carrier Wi-Fi features, as well as enhanced Bluetooth 5.

Commercial samples of the first Snapdragon 700 Series Mobile Platforms are anticipated to ship to customers 1H 2018.

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